TSMC will dominate the foundry for 5 years. 3D packaging is a new challenge for the future. | TechNews Technology News
August 9, 2020
TSMCNano will grow strongly in the second half of the year,3 Nano expectation 2022 Annual mass production and research and development 2 Nano, Yang Ruilin, research director of the International Obstetrics Institute, Industrial Technology Research Institute, believes the TSMC process 5 Will the foundry industry dominate during the year3D Packaging is a new challenge.
The global chip giant Intel (Intel）7 The progress of the nano-manufacturing process will be delayed and outsourced manufacturing orders can be released. At the same time, the mobile phone chip manufacturer Qualcomm (Qualcomm) Came out too 5 The nano processor may be from Samsung (Samsung) Transfer to TSMC’s foundry production, making TSMC’s leadership position in this process the focus of recent market attention.
TSMC relay 7 Nano process in 2018 Leading mass production in the year and in the powerful version 7 The nano process is the first to introduce extreme ultraviolet light (EUV) Lithography technology,5 Nanotechnology has continued to lead mass production this year and will grow strongly and make an approximate contribution in the second half of the year 8th% Performance.
TSMC 3 The nano process technology has been successfully developed and will continue to use fin-type field effect transistors (FinFET) Technology expected 2022 TSMC is confident about mass production in the second half of the year 3 By then, nanotechnology will still be the most advanced technology in the semiconductor industry.
To ensure process technology continues to lead, TSMC 2019 Leading research and development in the semiconductor industry 2 TSMC has not yet announced the mass production time, according to TSMC 2 Promotion of a generation of technical projections every year,2 Nano is to be expected 2024 Annual mass production.
Yang Ruilin analyzed this even though TSMC 2 The nano process will come from the past FinFET Technology, switch to Surround Gate (GAA) Technology, TSMC 2 The nano-process is still expected to maintain its leading position. Given the current situation, TSMC process technology will at least once again dominate the foundry industry 5 Year.
It’s just that process miniaturization technology is facing a physical bottleneck and pricing costs keep getting higher. Yang Ruilin said:3D The stacked advanced packaging technology will become more important and related equipment and material problems have yet to be resolved. This is also a new challenge for TSMC.
Yang Ruilin said TSMC has been focusing on advanced packaging for a long time. 2016 Introduced in The information According to the packaging technology too 2019 Has developed into 5 Generation of integrated fan-out stack packaging technology (InFO-PoP) And 2 Generation-integrated fan-out and substrate packaging technology (InFO_oS) And develop the 5 generation CoWoS。
In addition, TSMC developed a system integration chip SoICWith a copper-copper bond structure with silicon vias (TSV)Afford 3D IC The technology offers the possibility to continue Moore’s Law.
Yang Ruilin believes TSMC will continue to lead its rival Samsung in the advanced packaging space. Foreign investment also expects that advanced packaging will be key to TSMC’s higher technology and cost barriers, widening the gap with competitors.
