{"id":8056,"date":"2019-12-11T11:08:04","date_gmt":"2019-12-11T03:08:04","guid":{"rendered":"https:\/\/ljdevice.com.tw\/%e9%ab%98%e9%80%9a%e9%a9%8d%e9%be%8d%e6%96%b0%e7%94%a2%e5%93%81%e7%99%bc%e8%a1%a8%ef%bc%8c%e5%8f%b0%e7%a9%8d%e9%9b%bb%e4%bb%a3%e5%b7%a5%e9%a0%98%e5%85%88%e5%b0%8d%e6%89%8b%e6%88%90%e6%9c%80%e5%a4%a7\/"},"modified":"2019-12-11T11:16:45","modified_gmt":"2019-12-11T03:16:45","slug":"%e9%ab%98%e9%80%9a%e9%a9%8d%e9%be%8d%e6%96%b0%e7%94%a2%e5%93%81%e7%99%bc%e8%a1%a8%ef%bc%8c%e5%8f%b0%e7%a9%8d%e9%9b%bb%e4%bb%a3%e5%b7%a5%e9%a0%98%e5%85%88%e5%b0%8d%e6%89%8b%e6%88%90%e6%9c%80%e5%a4%a7","status":"publish","type":"post","link":"https:\/\/ljdevice.com.tw\/en\/%e9%ab%98%e9%80%9a%e9%a9%8d%e9%be%8d%e6%96%b0%e7%94%a2%e5%93%81%e7%99%bc%e8%a1%a8%ef%bc%8c%e5%8f%b0%e7%a9%8d%e9%9b%bb%e4%bb%a3%e5%b7%a5%e9%a0%98%e5%85%88%e5%b0%8d%e6%89%8b%e6%88%90%e6%9c%80%e5%a4%a7\/","title":{"rendered":"Qualcomm Announces Snapdragon 865 and 765(G): 5G For All in 2020, All The Details"},"content":{"rendered":"

by Andrei Frumusanu on December 4, 2019<\/em><\/p>\n

\"\"<\/p>\n

<\/p>\n

We\u2019re here in Maui for the second day of Qualcomm\u2019s fourth annual Snapdragon summit, for what is probably the most exciting part of the event, as we\u00a0cover\u00a0the disclosure of the\u00a0intricate details of the brand new Snapdragon 865 and 765 SoCs that the company had briefly announced yesterday.<\/a><\/p>\n

Indeed, this year, Qualcomm isn\u2019t launching just one SoC, but rather two new platforms at the same time. The Snapdragon 865 is self-explanatory in its positioning; as a direct successor to the Snapdragon 855 we expect the new chip to represent the best Qualcomm is able to deliver, and be the silicon that powers most of 2020\u2019s flagship devices. The new top-model this year is accompanied by the new Snapdragon 765 and 765G SoCs. As with other 7-series models since the launch of the new range, the new generation adds of the new features introduced with the new Snapdragon 865,\u00a0at a lower performance level\u00a0and a more affordable price\u00a0for what is becoming an increasingly\u00a0popular device category<\/a>.<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n
Qualcomm Snapdragon Flagship SoCs 2019-2020<\/td>\n<\/tr>\n
SoC<\/td>\n\n

Snapdragon 865<\/h4>\n<\/td>\n

Snapdragon 855<\/td>\n<\/tr>\n
CPU<\/td>\n1x Cortex\u00a0A77 <\/strong>
\n@ 2.84GHz<\/strong> 1x512KB pL2<\/p>\n

3x Cortex\u00a0A77<\/strong>
\n@ 2.42GHz<\/strong> 3x256KB pL2<\/p>\n

4x Cortex A55
\n@ 1.80GHz 4x128KB pL2<\/p>\n

4MB sL3 @ <\/strong>?MHz<\/td>\n

1x Kryo 485 Gold (A76 derivative)
\n@ 2.84GHz 1x512KB pL2<\/p>\n

3x Kryo 485 Gold (A76 derivative)
\n@ 2.42GHz 3x256KB pL2<\/p>\n

4x Kryo 485 Silver (A55 derivative)
\n@ 1.80GHz 4x128KB pL2<\/p>\n

2MB sL3 @ 1612MHz<\/td>\n<\/tr>\n

GPU<\/td>\nAdreno 650<\/strong> @ ? MHz<\/p>\n

+25% perf<\/strong>
\n+50% ALUs
\n+50% pixel\/clock
\n+0% texels\/clock<\/td>\n

Adreno 640 @ 585 MHz<\/td>\n<\/tr>\n
DSP \/ NPU<\/td>\nHexagon 698<\/p>\n

15 TOPS<\/strong> AI
\n(Total CPU+GPU+HVX+Tensor)<\/em><\/td>\n

Hexagon 690<\/p>\n

7 TOPS AI
\n(Total CPU+GPU+HVX+Tensor)<\/td>\n<\/tr>\n

Memory
\nController<\/td>\n		4x 16-bit CH<\/p>\n

@ 2133MHz LPDDR4X \/ 33.4GB\/s
\nor<\/em>
\n@ 2750MHz LPDDR5<\/strong>\u00a0 \/\u00a0 44.0GB\/s<\/p>\n

3MB system level cache<\/td>\n

4x 16-bit CH<\/p>\n

@ 1866MHz LPDDR4X 29.9GB\/s<\/p>\n

3MB system level cache<\/td>\n<\/tr>\n

ISP\/Camera<\/td>\nDual 14-bit Spectra 480 ISP<\/p>\n

1x 200MP <\/strong>or<\/em>\u00a064MP with ZSL<\/strong>
\nor<\/em>
\n2x 25MP with ZSL<\/strong><\/p>\n

4K video & 64MP <\/strong>burst capture<\/td>\n

Dual 14-bit Spectra 380 ISP<\/p>\n

1x 48MP or 2x 22MP<\/td>\n<\/tr>\n

Encode\/
\nDecode<\/td>\n		8K30 \/ 4K120<\/strong> 10-bit H.265<\/p>\n

Dolby Vision<\/strong>, HDR10+, HDR10, HLG<\/p>\n

720p960 infinite recording<\/strong><\/td>\n

4K60\u00a010-bit H.265<\/p>\n

HDR10, HDR10+, HLG<\/p>\n

720p480<\/td>\n<\/tr>\n

Integrated Modem<\/td>\nnone<\/strong>
\n(Paired with external X55<\/a>\u00a0only)<\/em><\/p>\n

(LTE Category 24\/22)
\nDL = 2500 Mbps<\/strong>
\n7x20MHz CA, 1024-QAM
\nUL = 316 Mbps
\n3x20MHz CA, 256-QAM<\/p>\n

(5G NR Sub-6 + mmWave)
\nDL = 7000 Mbps
\nUL = 3000 Mbps<\/strong><\/td>\n

Snapdragon X24 LTE
\n(Category 20)<\/p>\n

DL = 2000Mbps
\n7x20MHz CA, 256-QAM, 4×4<\/p>\n

UL = 316Mbps
\n3x20MHz CA, 256-QAM<\/td>\n<\/tr>\n

Mfc. Process<\/td>\nTSMC
\n7nm (N7P)<\/td>\n		TSMC
\n7nm (N7)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

We\u2019ll start off with the whole story on the Snapdragon 865, and in particular one surprising aspect what we didn\u2019t expect from the SoC this year;\u00a0its lack of an integrated modem, and what the story behind the design choice.<\/p>\n

No Modem Integration This Year?<\/h3>\n

The one aspect of the new Snapdragon 865 that overshadows all other new characteristics is the fact that Qualcomm designed it without an\u00a0integrated modem. Qualcomm already announced this change yesterday during the day 1 of the event, without much context into the matter. It\u2019s been fun seeing the reactions of various media and commenters theorising as to why this would be. It\u2019s also one of the very first aspects that we wanted to have clarified by\u00a0Qualcomm:<\/p>\n

The choice to not integrate the modem this year was a highly practical one, stemming from the complexity of 5G and the platform. There are actually more nuances to this though, and one thing that Qualcomm wants to make clear, is that this isn\u2019t just a matter of the company’s technical ability to actually create a chip with an integrated 5G modem;\u00a0it\u2019s keen to point out the Snapdragon 765, also announced today, which does exactly this.<\/p>\n

Instead, the technical difficulty of the 5G modem platform is actually on the platform and device side itself. As this will be the very first wide-range 5G implementation of a lot of OEM vendors who use Qualcomm\u2019s chips, there will be a large number of designs who will be integrating 5G for the first time. The problem is that this requires\u00a0a quite large development increase for the vendors creating the devices: they need to make sure their RF systems, antenna designs, as well as certifications of the systems are in full order. The nature of the 5G design complexity means that this process in a device\u2019s development cycle this time around is actually quite a lot more complicated and more time-consuming than what we\u2019ve seen from past 4G phones.<\/p>\n

Qualcomm\u2019s solution to the problem, in order to facilitate the vendor\u2019s device development cycle, is to separate the modem from the rest of the application processor, at least for this generation. The X55 modem has had a lead time to market, being available earlier than the Snapdragon 865 SoC by several months. OEM vendors thus would have been able to already start developing their 2020 handset designs\u00a0on the X55+S855 platform, focusing on getting the RF subsystems right, and then once the S865 becomes\u00a0available, it would be a\u00a0rather simple integration of the new AP without having to do much changes to the connectivity components of the new device design.<\/p>\n

\"\"<\/a><\/p>\n

Qualcomm\u2019s explanation makes a lot of sense in practical terms, and would bring time-to-market advantages. The company explains that in the future, it would re-integrate the modem back into the SoC, and this generation\u2019s choices just made more sense for today\u2019s situation in the market. Qualcomm isn\u2019t the only one to have made such a choice, Samsung\u2019s Exynos 990 SoC makes the same exact design decisions<\/a>, shipping the main SoC as a simple application processor without any modem, although we don\u2019t have any official backstory on their rationale for the design choice.<\/p>\n

The decision of shipping AP+discrete modem does have some disadvantages though. Motherboard PCB complexity does go up this generation, more so than competitors solutions which are able to integrate 5G modems (Such as the HiSilicon Kirin 990 5G<\/a>, or the MediaTek Dimensity 1000<\/a>). We also\u00a0expect some compromises in terms of battery efficiency due to the silicon overhead, however as a counter-argument, Apple\u2019s iPhones always have had separate AP+modem solutions, and the latest generation this year had amongst the strongest battery life performance of any device out there<\/a>, even with a competing Intel modem.<\/p>\n

As for the X55 modem itself: It\u2019s the same piece that Qualcomm announced earlier this year<\/a>, and this time around promises full global 5G connectivity ability (the X50\u2019s support was more limited). The modem chip is manufactured on the TSMC\u2019s 7nm process node, and the most important fact about the new combination is that\u00a0the\u00a0Snapdragon 865 SoC is exclusively tied to the X55 modem. This means that Qualcomm is selling the 865 SoC only as a pair with the X55 modem, and they do not offer support with any past 4G modem. In theory vendors could use another modem, but since they only sell the\u00a0new platform as a pair anyway, it would make very little sense for anybody to do this.<\/p>\n

One question that also came up is on whether vendors, for whatever reason, would still be able to develop 4G phones with the Snapdragon 865+X55 platform. Qualcomm says this would be possible if you essentially just ignore the X55\u2019s 5G capabilities, but they don\u2019t see any reason for any vendor to actually do this. In essence, bar any abnormal decision from some vendors, all Snapdragon 865 devices in 2020 will be full 5G devices.<\/p>\n

The Snapdragon 865 Application Processor: TSMC 7nm N7P<\/h3>\n

With the elephant in the room of the modem configuration being out of the way, we come to the actual Snapdragon 865 application processor.<\/p>\n

For me, the biggest surprise of the new chipset was Qualcomm\u2019s revelation that the chip is the fact that it\u2019s manufactured by TSMC on the improved 7nm \u201cN7P\u201d node \u2013 this is the same manufacturing process as used by Apple\u2019s A13 chipset. For the longest time were expecting\u00a0this generation to be manufactured on Samsung\u2019s 7nm EUV process (7LPP), given as the two companies had\u00a0announcement nearly 2 years ago.<\/a> It seems that the announcement was actually about the new Snapdragon 765, which does come on the 7LPP process node, and which we’ll be covering\u00a0in more detail later on in the article.<\/p>\n

\"\"<\/a><\/p>\n

Qualcomm only’s comment is\u00a0that their process node choices were based on various considerations, including volume. Reading between the lines, it\u2019s possible that Qualcomm wasn\u2019t as confident in Samsung\u2019s ability to manufacture the large quantities needed for the new chip. I\u2019ve also heard murmurs from other sources that Samsung\u2019s process simply doesn\u2019t have as good performance and leakage characteristics as TSMC, and in flagship parts, those aspects have to be taken higher\u00a0consideration\u00a0than in say a premium- or mid-range SoC. In any case, it\u2019s a big blow to Samsung\u2019s foundry business as having the design win this year was quite critical, as I do not expect them to win the 2021 flagship contract due to TSMC\u2019s 5nm leadership.<\/p>\n

As for the choice between TSMC\u2019s N7P and N7+ (+ is the EUV node), it seems HiSilicon is currently the only client for the node for the time being, with the Kirin 990 5G being the only chipset manufactured on the node until later in 2020. It\u2019s most likely that TSMC here simply doesn\u2019t yet have the EUV volume capacity and yields to fulfil Qualcomm\u2019s demand at this point in time, essentially being in a similar situation as Samsung, with the only difference being that TSMC has a viable high-volume DUV-based process ready as an alternative.<\/p>\n

Source:https:\/\/www.anandtech.com\/show\/15178\/qualcomm-announces-snapdragon-865-and-765-5g-for-all-in-2020-all-the-details<\/a><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

by Andrei Frumusanu on December 4, 2019<\/p>\n","protected":false},"author":7,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[98],"tags":[],"class_list":["post-8056","post","type-post","status-publish","format-standard","hentry","category-industrienachrichten"],"_links":{"self":[{"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/posts\/8056","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/comments?post=8056"}],"version-history":[{"count":2,"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/posts\/8056\/revisions"}],"predecessor-version":[{"id":8059,"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/posts\/8056\/revisions\/8059"}],"wp:attachment":[{"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/media?parent=8056"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/categories?post=8056"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ljdevice.com.tw\/en\/wp-json\/wp\/v2\/tags?post=8056"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}